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    STUDIA CHEMIA - Issue no. 3 / 2012  
         
  Article:   METALS LEACHING FROM WASTE PRINTED CIRCUIT BOARDS. PART II: INFLUENCE OF THIOUREA, THIOSULFATE AND THIOCYANATE CONCENTRATION ON THE LEACHING PROCESS.

Authors:  FLORICA IMRE-LUCACI, PETRU ILEA.
 
       
         
  Abstract:  

This paper presents the possibility of achieving high selectivity and efficiency at low FeCl3 and CuCl2 concentrations by adding small quantities of thiourea, thiosulfate and thiocyanate into the solution. The overall metal dissolution in the presence of 0.1 M thiosulfate, thiocyanate and thiourea is significantly higher (60 % compared to 32 %), than in chloride medium, for both oxidants. However, the increase of ligand concentration decreases the global metal dissolution degree, but improves the selectivity of the leaching processes. The results show that different oxidant and ligand combination promote the dissolution of one metal or another, making possible the use of these leaching systems for selective metal dissolution.

Keywords: FeCl3 and CuCl2, leaching systems, thiosulfate, thiocyanate, thiourea

 
         
     
         
         
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